Free Download Cadence SSV Release Version 21.16.000 | 43.5 GbThe SSV Release Team has unveiled the
Cadence Silicon Signoff and Verification (SSV) 21.10.000. This solution encapsulates a set of tools that address a series of electrical and physical signoff and verification steps that designers must perform on their design before tapeout.
Owner:Cadence
Product Name:Silicon Signoff and Verification (SSV)
Version:21.10.000 (Base Release) - 21.16.000-ISR6 *
Supported Architectures:x86_64
Website Home Page :www.cadence.com
Languages Supported:english
System Requirements:Linux **
Size:43.5 Gb
Featured Enhancements
Here is a list of some of the important updates made to Tempus Timing Signoff Solution and VoltusTM IC Power Integrity Solution for the 21.1 production release
Tempus
New Tempus Licenses
The following new licenses have been added in Tempus:
- 3nm option: Tempus Timing Signoff Solution 3nm Option
- Advanced Analysis option: Tempus Advanced Analysis Option
Set Instance Library Flow
The Tempus software has been enhanced to support instance-level library assignments. With this new flow, the software binds the user-specified library to instances, and overrides the tool's default library binding mechanism. You can revert to default library binding by using the corresponding reset command.
Voltus
Extreme Modeling Flow Enhanced
The Extreme Modeling (XM) flow has been improved to generate context-independent power-grid view (xPGV) models. This flow has the ability to dynamically create xPGV models for only those IP blocks of the design that a user wants to analyze.
The key capabilities of the new XM model are:
- accurately capture chip-level RC parasitics and demand current
- run your largest designs much faster with lower memory
- reuse IP models in different designs or for multiple instantiations within a design
Support for User-Defined Power Targets
The State-Propagation-Based Vectorless flow now supports specification of user-defined power targets for full-chip power analysis in the XP mode. You can specify the power targets for full chip, physical block, logical block, and power net. When these targets are specified, Voltus will automatically scale the toggle rates of clock gate ratio, input, macro, and sequential activities to meet the specified power targets.
New Command to Trim Cell Libraries
A new command, trim_pg_library, has been added that enables you to remove a cell or a list of cells from a cell library. This command allows you to trim the size of a cell library by removing unwanted cells, which can reduce the overall time required for extraction.
Ability to Display Temperature Maps in GUI
Voltus GUI has been enhanced to display hierarchical temperature maps using the configuration file and the hierarchical layer-based temperature files generated by Celsius (system-level thermal analysis tool). When these files are specified, you can view the tile-based temperature distribution for each layer of the chip.
More Here
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May 14, 2021
Silicon signoff and verification (SSV)encapsulates a set of tools that address a series of electrical and physical signoff and verification steps that designers must perform on their design before tapeout. These steps report errors that require iterative and incremental fixes, also called engineering change orders (ECOs), ensuring the design integrity from an electrical and physical standpoint. All of Cadence's signoff tools or capabilities are integrated in the Virtuoso platform, providing the same capabilities for mixed-signal and custom designs.
Knowledge and Learning
Learn about the latest Cadence offerings and solutions directly from our developers and experts. View interesting videos covering feature demos, troubleshooting information, flow launches, and more.
Cadenceis a pivotal leader in electronic design and computational expertise, using its Intelligent System Design strategy to turn design concepts into reality. Cadence customers are the world's most creative and innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications.
Base_SSV21.10.000.lnx86
Hotfix_SSV21.11.000-ISR1.lnx86
Hotfix_SSV21.12.000-ISR2.lnx86
Hotfix_SSV21.13.000-ISR3.lnx86
Hotfix_SSV21.14.000-ISR4.lnx86
Hotfix_SSV21.15.000-ISR5.lnx86
Hotfix_SSV21.16.000-ISR6.lnx86
Supported OS and Platform Levels
This build is based on the 2021 platform support matrix, linux only. From this release onwards RH7.4 is the minimum requirement and won't run on RH6.X.
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